MCF5270CAB100 Freescale Semiconductor, MCF5270CAB100 Datasheet - Page 25

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MCF5270CAB100

Manufacturer Part Number
MCF5270CAB100
Description
MCU V2 COLDFIRE 64K SRAM 160-QFP
Manufacturer
Freescale Semiconductor
Series
MCF527xr
Datasheets

Specifications of MCF5270CAB100

Core Processor
Coldfire V2
Core Size
32-Bit
Speed
100MHz
Connectivity
EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals
DMA, WDT
Number Of I /o
39
Program Memory Type
ROMless
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
160-QFP
Processor Series
MCF527x
Core
ColdFire V2
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
NNDK-MOD5272-KIT, NNDK-MOD5270-KIT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCF5270CAB100
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
29.4.3.3
29.4.3.4
29.4.3.5
29.4.3.6
29.4.3.7
29.5
29.5.1
29.5.2
30.1
30.1.1
30.2
30.3
30.3.1
30.4
30.4.1
30.4.2
30.4.3
30.4.4
30.4.5
30.4.6
30.4.7
30.5
30.5.1
30.5.2
30.5.2.1
30.5.2.2
30.5.3
30.5.3.1
30.5.3.2
30.5.3.3
30.6
30.6.1
30.6.1.1
30.6.2
30.7
30.7.1
30.7.2
Freescale Semiconductor
Paragraph
Number
Initialization/Application Information ........................................................................ 29-10
Introduction................................................................................................................... 30-1
External Signal Description .......................................................................................... 30-2
Real-Time Trace Support.............................................................................................. 30-2
Memory Map/Register Definition ................................................................................ 30-5
Background Debug Mode (BDM) .............................................................................. 30-16
Real-Time Debug Support .......................................................................................... 30-37
Processor Status, DDATA Definition......................................................................... 30-40
Restrictions ............................................................................................................. 29-10
Nonscan Chain Operation....................................................................................... 29-11
Overview................................................................................................................... 30-1
Begin Execution of Taken Branch (PST = 0x5) ....................................................... 30-4
Revision A Shared Debug Resources ....................................................................... 30-7
Address Attribute Trigger Register (AATR) ............................................................ 30-7
Address Breakpoint Registers (ABLR, ABHR) ....................................................... 30-8
Configuration/Status Register (CSR)........................................................................ 30-9
Data Breakpoint/Mask Registers (DBR, DBMR)................................................... 30-12
Program Counter Breakpoint/Mask Registers (PBR, PBMR)................................ 30-13
Trigger Definition Register (TDR) ......................................................................... 30-14
CPU Halt................................................................................................................. 30-16
BDM Serial Interface.............................................................................................. 30-17
BDM Command Set................................................................................................ 30-19
Theory of Operation................................................................................................ 30-37
Concurrent BDM and Processor Operation ............................................................ 30-39
User Instruction Set ................................................................................................ 30-40
Supervisor Instruction Set....................................................................................... 30-44
SAMPLE/PRELOAD Instruction......................................................................... 29-9
ENABLE_TEST_CTRL Instruction .................................................................. 29-10
HIGHZ Instruction.............................................................................................. 29-10
CLAMP Instruction ............................................................................................ 29-10
BYPASS Instruction........................................................................................... 29-10
Receive Packet Format ....................................................................................... 30-18
Transmit Packet Format...................................................................................... 30-19
ColdFire BDM Command Format...................................................................... 30-21
Command Sequence Diagrams........................................................................... 30-22
Command Set Descriptions ................................................................................ 30-23
Emulator Mode ................................................................................................... 30-39
MCF5271 Reference Manual, Rev. 2
Debug Support
Contents
Chapter 30
Title
Number
Page
xxv

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