MPC8313CZQADDC Freescale Semiconductor, MPC8313CZQADDC Datasheet - Page 1161

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MPC8313CZQADDC

Manufacturer Part Number
MPC8313CZQADDC
Description
Microprocessors - MPU 8313 REV2.2 PB NO EN EXT
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC8313CZQADDC

Processor Series
MPC8313
Core
e300
Data Bus Width
16 bit
Maximum Clock Frequency
133 MHz
Program Memory Size
16 KB
Data Ram Size
16 KB
Interface Type
I2C
Mounting Style
SMD/SMT
Package / Case
PBGA
Number Of Programmable I/os
32
Number Of Timers
4

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8313CZQADDC
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
3.1, 3-9
Chapter 4
4.1.1, 4-1
4.3.2.2, 4-14
4.3.2.2.4, 4-17
4.3.2.2.4, 4-17
4.3.3.1.1, 4-23
4.4.4, 4-32
4.4.7, 4-32
4.5.1, 4-33
4.5.1.6, 4-37
Freescale Semiconductor
LB_POR_CFG_BOOT
_ECC_DIS
RCWHR
9–11
Bits
ROMLOC
Name
MPC8313E PowerQUICC™ II Pro Integrated Processor Family Reference Manual, Rev. 2
Field
Boot time ECC
checking
(Binary)
Value
In Table 3-1, added the following row after LCLK[0:1]:
Throughout chapter—Editing done for consistency.
In Table 4-1, in the Description column for SRESET, changed the Timing,
Negation statement to read: ‘Occurs after being serviced.’
In Table 4-11, in the Description column for bits 9–11, added a sentence after the
first sentence as follows:
This bit combined with bit RLEXT determines where the device boots from.
Second paragraph, first sentence, was changed to read as follows:
The boot ROM location reset configuration word field, shown in Table 4-5,
establishes the location of boot ROM.
Combined Table 4-15 and Table 4-16, creating a new Table 4-15 as follows:
Deleted Table 4-16 and renumbered the rest of the tables in the chapter.
In Table 4-23, in the NOR Flash row, changed the setting for BR0[PS] to 10.
Second paragraph, last sentence, changed to read as follows:
When using the single crystal option, the frequency for SYS_CLK_IN must be
chosen such that the USB reference will be 24 or 48 MHz when utilizing the
divide by 1 or 2 option, that is, the SYS_CLK_IN must be 24 or 48 MHz.
Removed Section 4.4.7, “Clock Summary,” and Table 4-28. Renumbered the rest
of the tables in the chapter.
In Table 4-29, added a ‘Reset’ column.
In Table 4-33, bit 31, changed the description to read as follows:
Reserved, this bit should never be set.
000
001
010
011
100
101
110
111
DDR SDRAM
PCI
Reserved, should be cleared
Reserved, should be cleared
Reserved
Local bus GPCM—8-bit ROM
Local bus GPCM—16-bit ROM
Reserved
Legacy Mode (RLEXT = 00)
Table 4-15. Boot ROM Location
eLBC
1
1
Meaning
Local bus NAND Flash—8-bit large page ROM
Reserved
Reserved
Local bus NAND Flash—8-bit small page ROM
Reserved
Reserved
Reserved
Reserved
NAND Flash Mode (RLEXT = 01)
TSEC_MDC
Revision History
A-3

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