MPC8313CZQADDC Freescale Semiconductor, MPC8313CZQADDC Datasheet - Page 425

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MPC8313CZQADDC

Manufacturer Part Number
MPC8313CZQADDC
Description
Microprocessors - MPU 8313 REV2.2 PB NO EN EXT
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC8313CZQADDC

Processor Series
MPC8313
Core
e300
Data Bus Width
16 bit
Maximum Clock Frequency
133 MHz
Program Memory Size
16 KB
Data Ram Size
16 KB
Interface Type
I2C
Mounting Style
SMD/SMT
Package / Case
PBGA
Number Of Programmable I/os
32
Number Of Timers
4

Available stocks

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Part Number:
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Quantity:
10 000
Figure 9-20
Figure 9-21
Figure 9-22
four 8M × 8 DDR modules for a total of 128 Mbytes of system memory. Certain address and control lines
may require buffering. Analysis of the device’s AC timing specifications, desired memory operating
frequency, capacitive loads, and board routing loads can assist the system designer in deciding signal
buffering requirements. The DDR memory controller drives 15 address pins, but in this example the DDR
SDRAM devices use only 12 bits.
Freescale Semiconductor
shows an example DDR SDRAM configuration with four logical banks.
shows some typical signal connections.
shows an example DDR SDRAM configuration with two physical banks each comprised of
MCS, MRAS, MCAS, MWE
MPC8313E PowerQUICC™ II Pro Integrated Processor Family Reference Manual, Rev. 2
Figure 9-20. Typical Dual Data Rate SDRAM Internal Organization
BANK ADDR
CKE, MCK, MCK
COMMAND:
ADDR
MRAS
MCAS
‘SUB’
MWE
MCS
MCK
MCK
Figure 9-21. Typical DDR SDRAM Interface Signals
CKE
BA1,BA0
DM
ADDR
DQM
13
2
SDRAM
Control
A[12:0]
BA[1:0]
Write Enable
64M x 1 Byte
Command
Bus
CK
512 Mbit
Data-Out Registers
Logical
Bank 0
DQ[7:0]
DQS
Logical
Bank 1
Read Data Latch
MUX, MASK,
Data Bus
8
Logical
Bank 2
Data-In Registers
DATA
DATA
STROBE
Logical
Bank 3
DDR Memory Controller
9-31

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