DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 105

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

4.2.3
If an interrupt is accepted after a reset but before the stack pointer (SP) is initialized, PC and CCR
will not be saved correctly, leading to a program crash. To prevent this, all interrupt requests,
including NMI, are disabled immediately after a reset. The first instruction of the program is
always executed immediately after the reset state ends. This instruction should initialize the stack
pointer (example: MOV.L #xx:32, SP).
RES
Internal
address bus
Internal
read signal
Internal
write signal
Internal
data bus
(16 bits wide)
Interrupts after Reset
(1), (3)
(2), (4)
(5)
(6)
Address of reset vector ((1) = H'000000, (2) = H'000002)
Start address (contents of reset vector)
Start address
First instruction of program
Figure 4.4 Reset Sequence (Modes 5 to 7)
(1)
(2)
Vector fetch
(4)
Rev. 3.00 Mar 21, 2006 page 75 of 814
(3)
Internal
processing
Section 4 Exception Handling
Prefetch of
first program
instruction
(6)
(5)
REJ09B0302-0300