DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 192

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 7 Refresh Controller
Self-Refresh Mode: Some DRAM devices have a self-refresh function. After the SRFMD bit is
set to 1 in RFSHCR, when a transition to software standby mode occurs, the CAS and RAS
outputs go low in that order so that the DRAM self-refresh function can be used. On exit from
software standby mode, the CAS and RAS outputs both go high.
Table 7.7 shows the pin states in software standby mode. Figure 7.6 shows the signal output
timing.
Table 7.7
Signal
HWR
LWR
RD
CS
RFSH
Rev. 3.00 Mar 21, 2006 page 162 of 814
REJ09B0302-0300
3
Pin States in Software Standby Mode (PSRAME = 0, DRAME = 1)
CAS/WE
High-impedance
High-impedance
High-impedance
High
High
WE = 0
WE
WE
SRFMD = 0
CAS/WE
High-impedance
High-impedance
High-impedance
High
High
WE = 1
WE
WE
Software Standby Mode
CAS/WE
High
High
Low
Low
Low
SRFMD = 1 (self-refresh mode)
WE = 0
WE
WE
CAS/WE
Low
Low
High
Low
Low
WE = 1
WE
WE