DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 653

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

20.3
20.3.1
When the SSBY bit is cleared to 0 in SYSCR, execution of the SLEEP instruction causes a
transition from the program execution state to sleep mode. Immediately after executing the SLEEP
instruction the CPU halts, but the contents of its internal registers are retained. The DMA
controller (DMAC), refresh controller, and on-chip supporting modules do not halt in sleep mode.
Modules which have been placed in standby by the module standby function, however, remain
halted.
20.3.2
Sleep mode is exited by an interrupt, or by input at the RES or STBY pin.
Exit by Interrupt: An interrupt terminates sleep mode and causes a transition to the interrupt
exception handling state. Sleep mode is not exited by an interrupt source in an on-chip supporting
module if the interrupt is disabled in the on-chip supporting module. Sleep mode is not exited by
an interrupt other than NMI if the interrupt is masked by the I and UI bits in CCR and IPR.
Exit by RES
Exit by STBY
mode.
RES Input: Low input at the RES pin exits from sleep mode to the reset state.
RES
STBY
STBY Input: Low input at the STBY pin exits from sleep mode to hardware standby
RES
STBY
Sleep Mode
Transition to Sleep Mode
Exit from Sleep Mode
Rev. 3.00 Mar 21, 2006 page 623 of 814
Section 20 Power-Down State
REJ09B0302-0300