DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 670

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 21 Electrical Characteristics
21.2.3
Table 21.8 lists the A/D conversion characteristics.
Table 21.8 A/D Converter Characteristics
Conditions:
Item
Resolution
Conversion time
Analog input capacitance
Permissible signal-source impedance
Nonlinearity error
Offset error
Full-scale error
Quantization error
Absolute accuracy
Notes: 1 The value is for
Rev. 3.00 Mar 21, 2006 page 640 of 814
REJ09B0302-0300
H8/3052B F-ZTAT
output pin
2 The value is for
A/D Conversion Characteristics
V
V
CC
SS
= AV
= 5.0 V ±10%, AV
C
SS
= 0 V, = 2 MHz to 25 MHz, T
13 MHz.
13 MHz.
Figure 21.3 Output Load Circuit
R
H
CC
= 5.0 V ±10%, V
Min
10
5.36
5 V
R
L
Typ
10
Conditions
C = 90 pF: ports 4, 5, 6, 8, A (19 to 0),
C = 30 pF: ports 9, A, B
R = 2.4 k
R = 12 k
Input/output timing measurement levels
• Low: 0.8 V
• High: 2.0 V
REF
a
L
H
= –20°C to +75°C
= 4.5 V to AV
20
±3.5
±3.5
±0.5
D (15 to 8),
Max
10
10 *
5 *
±3.5
±4.0
2
1
CC
,
Unit
bits
µs
pF
k
LSB
LSB
LSB
LSB
LSB

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