DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 319

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Pin
PA
TIOCB
TCLKD
3
/TP
0
3
/
/
Pin Functions and Selection Method
ITU channel 0 settings (bit PWM0 in TMDR and bits IOB2 to IOB0 in TIOR0), bits
TPSC2 to TPSC0 in TCR4 to TCR0, bit NDER3 in NDERA, and bit PA
select the pin function as follows
ITU channel 0
settings
PA
NDER3
Pin function
Notes: 1. TIOCB
ITU channel 0
settings
IOB2
IOB1
IOB0
3
DDR
2. TCLKD input when TPSC2 = TPSC1 = TPSC0 = 1 in any of TCR4 to TCR0.
TIOCB
0
(1) in table
input when IOB2 = 1 and PWM0 = 0.
below
(2)
0
0
0
output
PA
3
0
0
0
1
input
TCLKD input *
Rev. 3.00 Mar 21, 2006 page 289 of 814
(1)
TIOCB
PA
(2) in table
below
2
3
output
0
1
0
1
input *
1
Section 9 I/O Ports
REJ09B0302-0300
3
DDR in PADDR
TP
3
(2)
output
1
1
1

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