DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 565

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Table 15.4 A/D Conversion Time (Single Mode)
Synchronization delay
Input sampling time
A/D conversion time
Note: Values in the table are numbers of states.
15.4.4
A/D conversion can be externally triggered. When the TRGE bit is set to 1 in ADCR, external
trigger input is enabled at the ADTRG pin. A high-to-low transition at the ADTRG pin sets the
ADST bit to 1 in ADCSR, starting A/D conversion. Other operations, in both single and scan
modes, are the same as if the ADST bit had been set to 1 by software. Figure 15.6 shows the
timing.
ADTRG
Internal trigger
signal
ADST
External Trigger Input Timing
Figure 15.6 External Trigger Input Timing
Symbol
t
t
t
D
SPL
CONV
Min
10
259
CKS = 0
Typ
63
Rev. 3.00 Mar 21, 2006 page 535 of 814
17
266
Max
A/D conversion
Min
6
131
Section 15 A/D Converter
REJ09B0302-0300
CKS = 1
Typ
31
Max
9
134

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