DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 83

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Notes: 1.
Exception
sources
RES = High
Exception-handling state
Bus-released state
2.
Reset state
From any state except hardware standby mode, a transition to the reset state occurs
whenever
From any state, a transition to hardware standby mode occurs when
End of
exception
handling
Reset
Interrupt
Trap instruction
End of bus
release
*1
RES
Figure 2.11 Classification of Exception Sources
goes low.
Bus
request
STBY = High,
Figure 2.12 State Transitions
Program execution state
NMI, IRQ , IRQ ,
or IRQ interrupt
Exception
End of bus release
Interrupt
External interrupts
Internal interrupts (from on-chip supporting modules)
Bus request
2
0
RES
= Low
1
SLEEP instruction
with SSBY = 1
Rev. 3.00 Mar 21, 2006 page 53 of 814
SLEEP
instruction
with SSBY = 0
Hardware standby mode
Software standby mode
Power-down state
Sleep mode
STBY
goes low.
REJ09B0302-0300
Section 2 CPU
*2