DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 87

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

2.9.3
The on-chip supporting modules are accessed in three states. The data bus is 8 or 16 bits wide,
depending on the register being accessed. Figure 2.16 shows the on-chip supporting module access
timing. Figure 2.17 indicates the pin states.
Read
access
Write
access
On-Chip Supporting Module Access Timing
Address bus
Internal read signal
Internal data bus
Internal write signal
Internal data bus
Address bus
AS
D
15
Figure 2.16 Access Cycle for On-Chip Supporting Modules
,
to D
RD HWR LWR
Figure 2.15 Pin States during On-Chip Memory Access
,
0
,
High
T state
1
T
1
High impedance
Address
Rev. 3.00 Mar 21, 2006 page 57 of 814
Bus cycle
Address
T state
2
Read data
Write data
T
2
T state
3
REJ09B0302-0300
Section 2 CPU