DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 802

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Appendix B Internal I/O Register
SYSCR—System Control Register
Rev. 3.00 Mar 21, 2006 page 772 of 814
REJ09B0302-0300
Bit
Initial value
Read/Write
SSBY
Software standby
R/W
0 SLEEP instruction causes transition to sleep mode
1 SLEEP instruction causes transition to software standby mode
7
0
Standby timer select 2 to 0
STS2
Bit 6
STS2
R/W
0
1
6
0
STS1
Bit 5
0
1
0
1
STS1
User bit enable
R/W
0 CCR bit 6 (UI) is used as an interrupt mask bit
1 CCR bit 6 (UI) is used as a user bit
5
0
NMI edge select
STS0
0 An interrupt is requested at the falling edge of NMI
1 An interrupt is requested at the rising edge of NMI
Bit 4
—
0
1
0
1
0
1
STS0
R/W
Standby Timer
Waiting time = 8,192 states
Waiting time = 16,384 states
Waiting time = 32,768 states
Waiting time = 65,536 states
Waiting time = 131,072 states
Waiting time = 1,024 states
Illegal setting
4
0
R/W
UE
3
1
RAM enable
NMIEG
H'F2
0 On-chip RAM is disabled
1 On-chip RAM is enabled
R/W
2
0
—
—
1
1
System control
RAME
R/W
0
1