DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 708

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Appendix A Instruction Set
Table A.3
Cycle
Instruction fetch
Branch address read
Stack operation
Byte data access
Word data access
Internal operation
Legend:
m: Number of wait states inserted into external device access
Rev. 3.00 Mar 21, 2006 page 678 of 814
REJ09B0302-0300
Number of States per Cycle
S
S
S
S
S
S
I
J
K
L
M
N
On-Chip
Memory
2
1
8-Bit
Bus
6
3
6
1
Supporting
On-Chip
Module
16-Bit
Bus
3
1
Access Conditions
2-State
Access
4
2
4
1
8-Bit Bus
3-State
Access
6 + 2 m
3 + m
6 + 2 m
1
External Device
2-State
Access
2
1
16-Bit Bus
3-State
Access
3 + m
1

Related parts for DF3052BX25V