DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 681

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
A
AS
CS
RD (read)
D
(read)
HWR, LWR
(write)
D
(write)
RFSH
A
AS
CS
LWR, RD
RFSH
23
15
15
23
3
to A
to D
to D
3
to A
, HWR,
0
0
0
0
Figure 21.14 PSRAM Bus Timing (Refresh Cycle): Three-State Access
Figure 21.13 PSRAM Bus Timing (Read/Write): Three-State Access
t
AD
t
AS1
T
T
1
1
t
RAD1
t
WDS2
t
t
t
RSD
WSD
RAD2
T
T
2
2
Rev. 3.00 Mar 21, 2006 page 651 of 814
t
RDS
Section 21 Electrical Characteristics
T
T
3
3
t
t
t
RAD3
t
SD
RAD3
SD
t
RDH
t
RP
REJ09B0302-0300

Related parts for DF3052BX25V