DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 839

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Figure G.1 shows the FP-100B package dimensions of the H8/3052B F-ZTAT. Figure G.2 shows
the TFP-100B package dimensions.
P-QFP100-14x14-0.50
JEITA Package Code
100
76
e
PRQP0100KA-A
75
RENESAS Code
1
Appendix G Package Dimensions
Z
D
Figure G.1 Package Dimensions (FP-100B)
*1
H
D
D
y
FP-100B/FP-100BV
*3
b
Previous Code
p
51
25
50
26
x
F
M
MASS[Typ.]
1.2g
Rev. 3.00 Mar 21, 2006 page 809 of 814
Appendix G Package Dimensions
Terminal cross section
Detail F
b
b
1
p
L
1
L
REJ09B0302-0300
NOTE)
1. DIMENSIONS"*1"AND"*2"
2. DIMENSION"*3"DOES NOT
DO NOT INCLUDE MOLD FLASH
INCLUDE TRIM OFFSET.
Reference
Symbol
e
D
E
A
H
H
A
A
b
b
c
c
x
y
Z
Z
L
L
1
p
1
1
2
1
D
E
D
E
Dimension in Millimeters
15.7
15.7
0.00
0.17
0.12
Min
0.3
0˚
Nom
2.70
16.0
16.0
0.12
0.22
0.20
0.17
0.15
14
14
0.5
1.0
1.0
0.5
1.0
16.3
16.3
3.05
0.25
0.27
0.22
0.08
0.10
Max
0.7
8˚