DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 695

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

NEG.B Rd
NEG.W Rd
NEG.L ERd
EXTU.W Rd
EXTU.L ERd
EXTS.W Rd
EXTS.L ERd
Mnemonic
W
W
W
B
L
L
L
0–Rd8
0–Rd16
0–ERd32
0
of Rd16)
0
of ERd32)
(<bit 7> of Rd16)
(<bits 15 to 8> of Rd16)
(<bit 15> of ERd32)
(<bits 31 to 16> of
ERd32)
(<bits 15 to 8>
(<bits 31 to 16>
Operation
Rd8
Rd16
ERd32
Instruction Length (bytes)
2
2
2
2
2
2
2
Addressing Mode and
Rev. 3.00 Mar 21, 2006 page 665 of 814
Appendix A Instruction Set
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I
Condition Code
—
—
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H
N
0
0
REJ09B0302-0300
Z
V
0
0
0
0
—
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—
C
States
No. of
2
2
2
2
2
2
2
*1