DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 591

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 18 ROM
18.2.4
Flash Memory Emulation in RAM
In the H8/3052BF, flash memory programming can be emulated in real time by overlapping the
flash memory with part of RAM ("overlap RAM"). When the emulation block set in RAMCR is
accessed while the emulation function is being executed, data written in the overlap RAM is read.
Emulation should be performed in user mode or user program mode.
SCI
Flash memory
RAM
Emulation block
Overlap RAM
(emulation is performed
on data written in RAM)
Application program
Execution state
Figure 18.3 Reading Overlap RAM Data in User Mode or User Program Mode
When overlap RAM data is confirmed, clear the RAMS bit to release RAM overlap, and actually
perform writes to the flash memory.
When the programming control program is transferred to RAM in on-board programming mode,
ensure that the transfer destination and the overlap RAM do not overlap, as this will cause data in
the overlap RAM to be rewritten.
Rev. 3.00 Mar 21, 2006 page 561 of 814
REJ09B0302-0300