DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 583

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
17.1.2
The on-chip RAM is controlled by SYSCR. Table 17.1 gives the address and initial value of
SYSCR.
Table 17.1 System Control Register
Address *
H'FFF2
Note: * Lower 16 bits of the address.
17.2
Bit
Initial value
Read/Write
One function of SYSCR is to enable or disable access to the on-chip RAM. The on-chip RAM is
enabled or disabled by the RAME bit in SYSCR. For details about the other bits, see section 3.3,
System Control Register (SYSCR).
System Control Register (SYSCR)
Register Configuration
Software standby
SSBY
Name
System control register
R/W
7
0
STS2
R/W
6
0
Standby timer select 2 to 0
STS1
R/W
5
0
STS0
R/W
4
0
SYSCR
Abbreviation
User bit enable
Rev. 3.00 Mar 21, 2006 page 553 of 814
R/W
UE
3
1
NMIEG
R/W
NMI edge select
2
0
R/W
R/W
Reserved bit
1
1
REJ09B0302-0300
Section 17 RAM
RAM enable
Enables or
disables
on-chip RAM
H'0B
Initial Value
RAME
R/W
0
1

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