DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 583

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

17.1.2
The on-chip RAM is controlled by SYSCR. Table 17.1 gives the address and initial value of
SYSCR.
Table 17.1 System Control Register
Address *
H'FFF2
Note: * Lower 16 bits of the address.
17.2
Bit
Initial value
Read/Write
One function of SYSCR is to enable or disable access to the on-chip RAM. The on-chip RAM is
enabled or disabled by the RAME bit in SYSCR. For details about the other bits, see section 3.3,
System Control Register (SYSCR).
System Control Register (SYSCR)
Register Configuration
Software standby
SSBY
Name
System control register
R/W
7
0
STS2
R/W
6
0
Standby timer select 2 to 0
STS1
R/W
5
0
STS0
R/W
4
0
SYSCR
Abbreviation
User bit enable
Rev. 3.00 Mar 21, 2006 page 553 of 814
R/W
UE
3
1
NMIEG
R/W
NMI edge select
2
0
R/W
R/W
Reserved bit
—
—
1
1
REJ09B0302-0300
Section 17 RAM
RAM enable
Enables or
disables
on-chip RAM
H'0B
Initial Value
RAME
R/W
0
1