DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 60

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 2 CPU
2.6
2.6.1
The H8/300H CPU has 62 types of instructions, which are classified in table 2.1.
Table 2.1
Function
Data transfer
Arithmetic operations
Logic operations
Shift operations
Bit manipulation
Branch
System control
Block data transfer
Notes: 1. POP.W Rn is identical to MOV.W @SP+, Rn.
Rev. 3.00 Mar 21, 2006 page 30 of 814
REJ09B0302-0300
2. Not available in the H8/3052BF.
3. Bcc is a generic branching instruction.
Instruction Set
Instruction Set Overview
PUSH.W Rn is identical to MOV.W Rn, @–SP.
POP.L ERn is identical to MOV.L @SP+, Rn.
PUSH.L ERn is identical to MOV.L Rn, @–SP.
Instruction Classification
ADD, SUB, ADDX, SUBX, INC, DEC, ADDS, SUBS, DAA,
SHAL, SHAR, SHLL, SHLR, ROTL, ROTR, ROTXL, ROTXR
BSET, BCLR, BNOT, BTST, BAND, BIAND, BOR, BIOR,
Instruction
MOV, PUSH *
DAS, MULXU, MULXS, DIVXU, DIVXS, CMP, NEG, EXTS,
EXTU
AND, OR, XOR, NOT
BXOR, BIXOR, BLD, BILD, BST, BIST
Bcc *
TRAPA, RTE, SLEEP, LDC, STC, ANDC, ORC, XORC, NOP
EEPMOV
3
, JMP, BSR, JSR, RTS
1
, POP *
1
, MOVTPE *
2
, MOVFPE *
2
Total 62 types
Types
3
18
4
8
14
5
9
1