DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 36

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 1 Overview
1.2
Figure 1.1 shows an internal block diagram.
Rev. 3.00 Mar 21, 2006 page 6 of 814
REJ09B0302-0300
P8
P8
P8
P8
0
/RFSH/IRQ
3
2
1
P6
P6
/CS
/CS
/CS
P6
P6
Block Diagram
P6
P8
1
2
P6
P6
0
EXTAL
5
/BREQ
/BACK
6
1
2
3
/WAIT
/HWR
STBY
4
XTAL
/LWR
/IRQ
/IRQ
/IRQ
FWE
4
3
/CS
MD
MD
MD
RES
NMI
/RD
/AS
2
1
0
0
3
2
1
0
Port B
Interrupt controller
16-bit integrated
controller (TPC)
(flash memory)
Programmable
Figure 1.1 Block Diagram
timing pattern
timer unit
ROM
RAM
(ITU)
Port A
H8/300H CPU
Port 3
DMA controller
Serial communication
(SCI)
controller
(DMAC)
Refresh
Watchdog timer
A/D converter
D/A converter
Address bus
Data bus (upper)
Data bus (lower)
interface
(WDT)
2 channels
Port 4
Port 7
P5
P5
P5
P5
P2
P2
P2
P2
P2
P2
P2
P2
P1
P1
P1
P1
P1
P1
P1
P1
P9
P9
P9
P9
P9
P9
3
2
1
0
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
5
4
3
2
1
0
/A
/A
/A
/A
/A
/A
/A
/A
/A
/A
/A
/A
/A
/A
/A
/A
/A
/A
/A
/A
/SCK
/SCK
/RxD
/RxD
/TxD
/TxD
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
1
0
1
0
1
0
/IRQ
/IRQ
5
4

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