DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 147

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Bit 5—Address 21 Enable (A21E): Enables PA
Writing 0 in this bit enables A
cannot be modified and PA
Bits 4 to 1—Reserved: Read-only bits, always read as 1.
Bit 0—Bus Release Enable (BRLE): Enables or disables release of the bus to an external device.
Bit 5: A21E
0
1
Bit 0: BRLE
0
1
Description
PA
PA
Description
The bus cannot be released to an external device; BREQ and BACK can be
used as input/output pins
The bus can be released to an external device
6
6
is the A
is the PA
6
has its ordinary input/output functions.
21
address output from PA
21
6
address output pin
/TP
6
/TIOCA
2
6
input/output pin
to be used as the A
6
. In modes other than 3, 4, and 6 this bit
Rev. 3.00 Mar 21, 2006 page 117 of 814
21
address output pin.
Section 6 Bus Controller
REJ09B0302-0300
(Initial value)
(Initial value)

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