DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 835

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Reset in T
T
the input state. AS, RD, HWR, and LWR go high, and the data bus goes to the high-impedance
state. The address bus is initialized to the low output level 0.5 state after the low level of RES is
sampled. The same timing applies when a reset occurs during a wait state (T
2
RES
Internal
reset signal
Address bus
CS
CS
AS
RD (read access)
HWR, LWR
(write access)
Data bus
(write access)
I/O port
state of an external memory access cycle. As soon as RES goes low, all ports are initialized to
0
7
to CS
2
State: Figure D.2 is a timing diagram for the case in which RES goes low during the
1
Figure D.2 Reset during Memory Access (Reset during T
Access to external address
T
1
T
Rev. 3.00 Mar 21, 2006 page 805 of 814
2
T
3
Appendix D Pin States
W
2
H'000000
).
State)
REJ09B0302-0300
High impedance
High impedance
High impedance