DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 33

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Feature
Bus controller
Refresh
controller
DMA controller
(DMAC)
Description
Address space can be partitioned into eight areas, with independent bus
specifications in each area
Chip select output available for areas 0 to 7
8-bit access or 16-bit access selectable for each area
Two-state or three-state access selectable for each area
Selection of four wait modes
Bus arbitration function
DRAM refresh
Pseudo-static RAM refresh
Usable as an interval timer
Short address mode
Full address mode
Directly connectable to 16-bit-wide DRAM
CAS-before-RAS refresh
Self-refresh mode selectable
Self-refresh mode selectable
Maximum four channels available
Selection of I/O mode, idle mode, or repeat mode
Can be activated by compare match/input capture A interrupts from ITU
channels 0 to 3, transmit-data-empty and receive-data-full interrupts from
SCI channel 0, or external requests
Maximum two channels available
Selection of normal mode or block transfer mode
Can be activated by compare match/input capture A interrupts from ITU
channels 0 to 3, external requests, or auto-request
Rev. 3.00 Mar 21, 2006 page 3 of 814
Section 1 Overview
REJ09B0302-0300