DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 88

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 2 CPU
2.9.4
The external address space is divided into eight areas (areas 0 to 7). Bus-controller settings
determine whether each area is accessed via an 8-bit or 16-bit bus, and whether it is accessed in
two or three states. For details see section 6, Bus Controller.
Rev. 3.00 Mar 21, 2006 page 58 of 814
REJ09B0302-0300
Address bus
AS
D
15
Access to External Address Space
,
to D
RD HWR LWR
Figure 2.17 Pin States during Access to On-Chip Supporting Modules
,
0
,
High
T
1
High impedance
Address
T
2
T
3