DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 523

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Sample Procedure for Avoiding Low-Level Output
As this sample procedure temporarily places the SCK pin in the input state, the SCK/port pin
should be pulled up beforehand with an external circuit.
With DDR = 1, DR = 1, C/A = 1, CKE1 = 0, CKE0 = 0, and TE = 1, make the following settings
in the order shown.
1. End of serial data transmission
2. TE bit = 0
3. CKE1 bit = 1
4. C/A bit = 0 ... switchover to port output
5. CKE1 bit = 0
SCK/port
Data
TE
C/A
CKE1
CKE0
Figure 13.24 Operation when Switching from SCK Pin Function to Port Pin Function
Bit 6
(Example of Preventing Low-Level Output)
Bit 7
1. End of transmission
2. TE = 0
3. CKE1 = 1
Section 13 Serial Communication Interface
Rev. 3.00 Mar 21, 2006 page 493 of 814
4. C/A = 0
High-level output
5. CKE1 = 0
REJ09B0302-0300

Related parts for DF3052BX25V