DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 262

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 8 DMA Controller
Figure 8.18 shows the timing when the DMAC is activated by the falling edge of DREQ in block
transfer mode.
Rev. 3.00 Mar 21, 2006 page 232 of 814
REJ09B0302-0300
Figure 8.18 Timing of DMAC Activation by Falling Edge of DREQ
DREQ
Address
bus
RD
HWR
TEND
,
LWR
T
1
T
2
T
1
DMAC cycle
T
2
T
1
T
2
End of 1 block transfer
T
1
T
2
T
1
Next sampling
Minimum 4 states
CPU cycle
T
2
DREQ in Block Transfer Mode
DREQ
DREQ
T
1
T
2
T
d
DMAC cycle
T
1
T
2

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