DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 534

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 14 Smart Card Interface
Note: A loop-back test can be performed by setting both RE and TE to 1 without connecting a
Rev. 3.00 Mar 21, 2006 page 504 of 814
REJ09B0302-0300
smart card.
Card-processing device
H8/3052BF
Figure 14.2 Smart Card Interface Connection Diagram
Chip
TxD
RxD
SCK
Px (port)
0
0
0
Reset line
Clock line
Data line
V
CC
I/O
CLK
RST
Smart card

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