DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 534

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 14 Smart Card Interface
Note: A loop-back test can be performed by setting both RE and TE to 1 without connecting a
Rev. 3.00 Mar 21, 2006 page 504 of 814
REJ09B0302-0300
smart card.
Card-processing device
H8/3052BF
Figure 14.2 Smart Card Interface Connection Diagram
Chip
TxD
RxD
SCK
Px (port)
0
0
0
Reset line
Clock line
Data line
V
CC
I/O
CLK
RST
Smart card