DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 784

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Appendix B Internal I/O Register
RDR—Receive Data Register
SCMR—Smart Card Mode Register
Rev. 3.00 Mar 21, 2006 page 754 of 814
REJ09B0302-0300
Bit
Initial value
Read/Write
Bit
Initial value
Read/Write
Smart card data transfer direction
0 TDR contents are transmitted LSB-first
1 TDR contents are transmitted MSB-first
Received data is stored LSB-first in RDR
Received data is stored MSB-first in RDR
—
—
R
7
0
7
1
Smart card data invert
0 Unmodified TDR contents are transmitted
1 Inverted TDR contents are transmitted
Received data is stored unmodified in RDR
Received data are inverted before storage in RDR
—
—
R
6
0
6
1
Smart card interface mode select
0 Smart card interface function is disabled
1 Smart card interface function is enabled
—
—
R
5
0
5
1
Serial receive data
—
—
R
4
0
4
1
(Initial value)
SDIR
R/W
R
3
0
3
0
H'B5
H'B6
SINV
R/W
R
2
0
2
0
(Initial value)
—
—
(Initial value)
R
1
0
1
1
SMIF
R/W
R
0
0
0
0
SCI0
SCI0