DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 258

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 8 DMA Controller
Figure 8.14 shows the timing when the DMAC is activated by low input at a DREQ pin. This
example shows a word-size transfer from a 16-bit two-state access area to another 16-bit two-state
access area. The DMAC continues the transfer while the DREQ pin is held low.
Rev. 3.00 Mar 21, 2006 page 228 of 814
REJ09B0302-0300
DREQ
Address
bus
RD
HWR
TEND
,
LWR
Figure 8.14 Bus Timing of DMA Transfer Requested by Low DREQ
T
1
CPU cycle
T
2
T
3
T
d
T
1
DMAC cycle
Source
address
T
2
T
Destination
address
1
T
2
T
CPU cycle
1
T
2
T
d
DMAC cycle
(last transfer cycle)
T
1
Source
address
T
2
DREQ
DREQ
DREQ Input
T
Destination
address
1
T
2
T
CPU cycle
1
T
2

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