DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 466

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 13 Serial Communication Interface
Rev. 3.00 Mar 21, 2006 page 436 of 814
REJ09B0302-0300
Full duplex communication
The transmitting and receiving sections are independent, so the SCI can transmit and receive
simultaneously. The transmitting and receiving sections are both double-buffered, so serial
data can be transmitted and received continuously.
Built-in baud rate generator with selectable bit rates
Selectable transmit/receive clock sources: internal clock from baud rate generator, or external
clock from the SCK pin.
Four types of interrupts
Transmit-data-empty, transmit-end, receive-data-full, and receive-error interrupts are requested
independently. The transmit-data-empty and receive-data-full interrupts from SCI0 can
activate the DMA controller (DMAC) to transfer data.
Data length: 8 bits
Receive error detection: overrun errors