DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 667

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Item
Read data access time 3
Read data access time 4
Precharge time
Wait setup time
Wait hold time
Bus request setup ime
Bus acknowledge delay time 1
Bus acknowledge delay time 2
Bus-floating time
Table 21.5 Refresh Controller Bus Timing
Conditions:
Item
RAS delay time 1
RAS delay time 2
RAS delay time 3
Row address hold time *
RAS precharge time *
CAS to RAS precharge time *
CAS pulse width
RAS access time *
Address access time
CAS access time *
Write data setup time 3
CAS setup time *
Read strobe delay time
V
V
CC
SS
= AV
= 5.0 V ±10%, AV
SS
= 0 V, = 2 MHz to 25 MHz, T
Symbol
t
t
t
t
t
t
t
t
t
Symbol
t
t
t
t
t
t
t
t
t
t
t
t
t
ACC3
ACC4
PCH
WTS
WTH
BRQS
BACD1
BACD2
BZD
RAD1
RAD2
RAD3
RAH
RP
CRP
CAS
RAC
AA
CAC
WDS3
CSR
RSD
CC
= 5.0 V ±10%, V
Min
—
—
1.0 t
25
5
25
—
—
—
Min
—
—
—
0.5 t
1.0 t
1.0 t
1.0 t
—
—
—
15
0.5 t
—
cyc
cyc
cyc
cyc
cyc
cyc
- 20
- 5
- 15
- 15
- 18
- 15
Conditions
Conditions
Rev. 3.00 Mar 21, 2006 page 637 of 814
REF
a
Max
1.0 t
2.0 t
—
—
—
—
30
30
40
Max
18
18
18
—
—
—
—
2.0 t
1.5 t
1.0 t
—
—
25
= –20°C to +75°C
Section 21 Electrical Characteristics
= 4.5 V to AV
cyc
cyc
cyc
cyc
cyc
- 28
- 32
- 35
- 40
- 30
Unit
ns
Unit
ns
CC
,
REJ09B0302-0300
Test
Conditions
Figure 21.4,
Figure 21.5
Figure 21.6
Figure 21.17
Test
Conditions
Figure 21.7 to
Figure 21.14