DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 592

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 18 ROM
18.2.5
Item
Total erase
Block erase
Programming control program *
Note: * To be provided by the user, in accordance with the recommended algorithm.
Rev. 3.00 Mar 21, 2006 page 562 of 814
REJ09B0302-0300
Differences between Boot Mode and User Program Mode
Application program
Programming data
Figure 18.4 Writing Overlap RAM Data in User Program Mode
Flash memory
Boot Mode
Yes
No
Boot program is initiated,
and programming control
program is transferred from
host to on-chip RAM, and
executed there.
program execution state
Programming control
User Program Mode
Yes
Yes
Program that controls
programming program in flash
memory is executed. Program
should be written beforehand in
PROM mode and boot mode.
(programming data)
Overlap RAM
RAM
SCI