DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 504

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 13 Serial Communication Interface
Communication Formats: Four formats are available. Parity-bit settings are ignored when a
multiprocessor format is selected. For details see table 13.10.
Clock: See the description of asynchronous mode.
Rev. 3.00 Mar 21, 2006 page 474 of 814
REJ09B0302-0300
Figure 13.9 Example of Communication among Processors using Multiprocessor Format
Serial data
Legend:
MPB: Multiprocessor bit
Transmitting
processor A
processor
Receiving
(ID = 01)
(Sending Data H'AA to Receiving Processor A)
ID-sending cycle: receiving
processor address
processor B
H'01
Receiving
(ID = 02)
(MPB = 1)
Serial communication line
processor C
Data-sending cycle:
data sent to receiving
processor specified by ID
Receiving
(ID = 03)
H'AA
(MPB = 0)
processor D
Receiving
(ID = 04)

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