DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 785

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
SMR—Serial Mode Register
BRR—Bit Rate Register
SCR—Serial Control Register
Bit
Initial value
Read/Write
Note: Bit functions are the same as for SCI0.
Bit
Initial value
Read/Write
Note: Bit functions are the same as for SCI0.
Bit
Initial value
Read/Write
Note: Bit functions are the same as for SCI0.
TIE
R/W
R/W
R/W
C/
7
0
7
1
7
0
A
CHR
R/W
R/W
R/W
RIE
6
0
6
1
6
0
R/W
R/W
R/W
PE
TE
5
0
5
1
5
0
R/W
R/W
R/W
O/
RE
4
0
4
1
4
0
E
Rev. 3.00 Mar 21, 2006 page 755 of 814
STOP
MPIE
R/W
R/W
R/W
3
0
3
1
3
0
Appendix B Internal I/O Register
H'B8
H'B9
H'BA
TEIE
R/W
R/W
R/W
MP
2
0
2
1
2
0
CKS1
CKE1
R/W
R/W
R/W
REJ09B0302-0300
1
0
1
1
1
0
CKS0
CKE0
R/W
R/W
R/W
0
0
0
1
0
0
SCI1
SCI1
SCI1

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