DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 627

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 18 ROM
18.9
Flash Memory Emulation in RAM
Making a setting in the RAM control register (RAMCR) enables part of RAM to be overlapped
onto the flash memory area so that data to be written to flash memory can be emulated in RAM in
real time. After the RAMCR setting has been made, accesses can be made from the flash memory
area or the RAM area overlapping flash memory. Emulation can be performed in user mode and
user program mode. Figure 18.15 shows an example of emulation of real-time flash memory
programming.
Start of emulation program
Set RAMCR
Write tuning data to overlap
RAM
Execute application program
No
Tuning OK?
Yes
Clear RAMCR
Write to flash memory emulation
block
End of emulation program
Figure 18.15 Flowchart for Flash Memory Emulation in RAM
Rev. 3.00 Mar 21, 2006 page 597 of 814
REJ09B0302-0300

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