DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 581

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 17 RAM
Section 17 RAM
17.1
Overview
The H8/3052BF has 8 kbytes of high-speed static RAM on-chip. The RAM is connected to the
CPU by a 16-bit data bus. The CPU accesses both byte data and word data in two states, making
the RAM useful for rapid data transfer.
The on-chip RAM of the H8/3052BF is assigned to addresses H'FDF10 to H'FFF0F in modes 1, 2,
5, and 7, and to addresses H'FFDF10 to H'FFFF0F in modes 3, 4, and 6. The RAM enable bit
(RAME) in the system control register (SYSCR) can enable or disable the on-chip RAM.
Rev. 3.00 Mar 21, 2006 page 551 of 814
REJ09B0302-0300