DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 63

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Table 2.3
Instruction
MOV
MOVFPE
MOVTPE
POP
PUSH
Note: * Size refers to the operand size.
B:
W: Word
L:
Byte
Longword
Data Transfer Instructions
Size *
B/W/L
B
B
W/L
W/L
Function
(EAs)
Moves data between two general registers or between a general
register and memory, or moves immediate data to a general register.
(EAs)
Cannot be used in the H8/3052BF.
Rs
Cannot be used in the H8/3052BF.
@SP+
Pops a general register from the stack. POP.W Rn is identical to
MOV.W @SP+, Rn. Similarly, POP.L ERn is identical to MOV.L
@SP+, ERn.
Rn
Pushes a general register onto the stack. PUSH.W Rn is identical to
MOV.W Rn, @–SP. Similarly, PUSH.L ERn is identical to MOV.L
ERn, @–SP.
(EAs)
@–SP
Rd, Rs
Rd
Rn
(EAd)
Rev. 3.00 Mar 21, 2006 page 33 of 814
REJ09B0302-0300
Section 2 CPU