DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 467

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
13.1.2
Figure 13.1 shows a block diagram of the SCI.
SCK
RxD
Legend:
RSR:
RDR:
TSR:
TDR:
SMR:
SCR:
SSR:
BRR:
TxD
Receive shift register
Receive data register
Transmit shift register
Transmit data register
Serial mode register
Serial control register
Serial status register
Bit rate register
Block Diagram
RDR
RSR
Figure 13.1 SCI Block Diagram
Parity generate
Parity check
TDR
TSR
Module data bus
receive control
Transmit/
SMR
SSR
SCR
Section 13 Serial Communication Interface
Rev. 3.00 Mar 21, 2006 page 437 of 814
External clock
Clock
Baud rate
generator
BRR
REJ09B0302-0300
TEI
TXI
RXI
ERI
/4
/16
/64
Internal
data bus

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