DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 679

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

A
AS
CS (RAS
HWR (UCAS),
LWR (LCAS)
RD (WE)
(read)
RD (WE)
(write)
RFSH
D
(read)
D
(write)
9
15
15
to A
3
to D
to D
1
0
0
)
Figure 21.10 DRAM Bus Timing (Read/Write): Three-State Access
t
AD
t
AS1
T
1
t
RAH
t
t
RAD1
ASD
t
AD
t
WDS3
— 2CAS
t
RAC
t
AS1
T
CAS Mode —
CAS
CAS
t
2
AA
t
ASD
t
CAC
Rev. 3.00 Mar 21, 2006 page 649 of 814
t
t
RDS
CAS
Section 21 Electrical Characteristics
T
3
t
RAD3
t
t
SD
SD
t
WDH
t
RDH
t
t
CRP
RP
REJ09B0302-0300