DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 771

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
NDERB—Next Data Enable Register B
NDERA—Next Data Enable Register A
Bit
Initial value
Read/Write
Bit
Initial value
Read/Write
NDER15
NDER7
Next data enable 15 to 8
Next data enable 7 to 0
NDER15 to NDER8
R/W
R/W
NDER7 to NDER0
7
0
7
0
Bits 7 to 0
Bits 7 to 0
NDER14
NDER6
0
1
0
1
R/W
R/W
6
0
6
0
NDER13
NDER5
R/W
R/W
Description
TPC outputs TP
(NDR15 to NDR8 are not transferred to PB to PB )
TPC outputs TP
(NDR15 to NDR8 are transferred to PB to PB )
Description
TPC outputs TP to TP are disabled
(NDR7 to NDR0 are not transferred to PA to PA )
TPC outputs TP to TP are enabled
(NDR7 to NDR0 are transferred to PA to PA )
5
0
5
0
NDER12
NDER4
R/W
R/W
4
0
4
0
15
15
7
7
NDER11
Rev. 3.00 Mar 21, 2006 page 741 of 814
NDER3
to TP are disabled
to TP are enabled
R/W
R/W
3
0
3
0
0
0
8
8
Appendix B Internal I/O Register
NDER10
H'A2
H'A3
NDER2
R/W
R/W
2
0
2
0
NDER9
NDER1
7
7
R/W
R/W
REJ09B0302-0300
1
0
1
0
7
7
0
0
NDER8
NDER0
0
R/W
R/W
0
0
0
0
0
TPC
TPC

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