DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 645

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

19.5.3
The DIVCR setting changes the frequency, so note the following points.
Select a frequency division ratio that stays within the assured operation range specified for the
clock cycle time t
settings that give system clock frequencies less than 2 MHz.
All on-chip module operations are based on . Note that the timing of timer operations, serial
communication, and other time-dependent processing differs before and after any change in
the division ratio. The waiting time for exit from software standby mode also changes when
the division ratio is changed. For details, see section 20.4.3, Selection of Waiting Time for Exit
from Software Standby Mode.
Usage Notes
cyc
in the AC electrical characteristics. Note that
Rev. 3.00 Mar 21, 2006 page 615 of 814
Section 19 Clock Pulse Generator
MIN
= 2 MHz. Avoid
REJ09B0302-0300