DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 586

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 18 ROM
18.2
18.2.1
18.2.2
When the mode pins and the FWE pin are set in the reset state and a reset-start is executed, the
microcomputer enters an operating mode as shown in figure 18.2. In user mode, flash memory can
be read but not programmed or erased.
Rev. 3.00 Mar 21, 2006 page 556 of 814
REJ09B0302-0300
PROM mode
Flash memory can be programmed/erased in PROM mode, using a PROM programmer, as
well as in on-board programming mode.
Legend:
FLMCR1:
FLMCR2:
EBR1:
EBR2:
RAMCR:
Overview
Block Diagram
Mode Transitions
Flash memory control register 1
Flash memory control register 2
Erase block register 1
Erase block register 2
RAM control register
FLMCR1
FLMCR2
RAMCR
EBR1
EBR2
Figure 18.1 Block Diagram of Flash Memory
Internal data bus (16 bits)
Internal address bus
Bus interface/controller
Flash memory
(512 kbytes)
Operating
mode
FWE pin
Mode pin