DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 542

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 14 Smart Card Interface
Rev. 3.00 Mar 21, 2006 page 512 of 814
REJ09B0302-0300
(1) Data write
(2) Transfer from
TXI
(TEND interrupt)
(3) Serial data output
Note: When the ERS flag is set, it should be cleared until transfer of the last bit (D7 in LSB-first
I/O data
TDR to TSR
In case of normal transmission: TEND flag is set
In case of transmit error:
transmission, D0 in MSB-first transmission) of the next transfer data to be transmitted has
been completed.
Figure 14.5 Relation between Transmit Operation and Internal Registers
DS
Da
Figure 14.6 TEND Flag Occurrence Timing
Data 1
Data 1
Data 1
Db
TDR
Dc
ERS flag is set
Steps (2) and (3) above are repeated until the TEND flag is set
Dd
12.5 etu
11.0 etu
(shift register)
De
Data 1
TSR
Df
Dg
; Data remains in TDR
Dh
Data 1
Dp
Guard
I/O signal line output
DE
GM = 0
GM = 1