DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 680

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 21 Electrical Characteristics
Rev. 3.00 Mar 21, 2006 page 650 of 814
REJ09B0302-0300
A
AS
CS (RAS)
HWR (UCAS),
LWR (LCAS)
RD (WE)
RFSH
CS (RAS)
HWR
LWR
RFSH
9
to A
3
3
(
(
LCAS)
1
UCAS
Figure 21.11 DRAM Bus Timing (Refresh Cycle): Three-State Access
),
Figure 21.12 DRAM Bus Timing (Self-Refresh Mode)
T
1
t
t
ASD
ASD
t
t
CSR
CSR
t
t
RAD2
RAD2
— 2 CAS
— 2 CAS
t
t
CSR
CSR
CAS Mode —
CAS
CAS
CAS Mode —
CAS
CAS
T
2
T
3
t
t
RAD3
RAD3
t
t
SD
SD