DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 683

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
BREQ
BACK
A
AS, RD,
HWR, LWR
NMI
IRQ
IRQ
23
to A
E
L
IRQ : Edge-sensitive IRQ
IRQ
0
(j = 0 to 2)
,
NMI
IRQ
E
L
: Level-sensitive IRQ (i = 0 to 5)
j
t
BRQS
Figure 21.17 Bus-Release Mode Timing
Figure 21.16 Interrupt Input Timing
i
i
t
t
t
NMIS
NMIS
NMIS
t
BACD1
t
t
t
t
BZD
NMIH
NMIH
NMIW
Rev. 3.00 Mar 21, 2006 page 653 of 814
t
BRQS
Section 21 Electrical Characteristics
REJ09B0302-0300
t
t
BACD2
BZD

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