DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 203

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Refresh Cycle Priority Order: When there are simultaneous bus requests, the priority order is:
For details see section 6.3.7, Bus Arbiter Operation.
Wait State Insertion: When bit AST3 is set to 1 in ASTCR, the wait state controller (WSC) can
insert wait states into bus cycles and refresh cycles. For details see section 6.3.5, Wait Modes.
Self-Refresh Mode: Some pseudo-static RAM devices have a self-refresh function. After the
SRFMD bit is set to 1 in RFSHCR, when a transition to software standby mode occurs, the
H8/3052BF’ CS
self-refresh function can be used. On exit from software standby mode, the RFSH output goes
high.
Table 7.8 shows the pin states in software standby mode. Figure 7.16 shows the signal output
timing.
Table 7.8
Signal
CS
RD
HWR
LWR
RFSH
3
(High)
Pin States in Software Standby Mode (PSRAME = 1, DRAME = 0)
3
output goes high and its RFSH output goes low so that the pseudo-static RAM
External bus master > refresh controller > DMA controller > CPU
SRFMD = 0
High
High-impedance
High-impedance
High-impedance
High
Software Standby Mode
SRFMD = 1 (Self-Refresh Mode)
High
High-impedance
High-impedance
High-impedance
Low
Rev. 3.00 Mar 21, 2006 page 173 of 814
Section 7 Refresh Controller
REJ09B0302-0300
(Low)