DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 834

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Appendix D Pin States
D.2
Reset in T
T
the input state. AS, RD, HWR, and LWR go high, and the data bus goes to the high-impedance
state. The address bus is initialized to the low output level 0.5 state after the low level of RES is
sampled. Sampling of RES takes place at the fall of the system clock ( ).
Rev. 3.00 Mar 21, 2006 page 804 of 814
REJ09B0302-0300
1
state of an external memory access cycle. As soon as RES goes low, all ports are initialized to
RES
Internal
reset signal
Address bus
CS
CS
AS
RD (read access)
HWR, LWR
(write access)
Data bus
(write access)
I/O port
0
7
to CS
Pin States at Reset
1
State: Figure D.1 is a timing diagram for the case in which RES goes low during the
1
Figure D.1 Reset during Memory Access (Reset during T
High
High
High
Access to external address
T
1
T
2
T
3
H'000000
1
State)
High impedance
High impedance
High impedance