DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 640

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 19 Clock Pulse Generator
Table 19.1 (2)
External Capacitance Values
Frequency f (MHz)
C
Crystal Resonator: Figure 19.3 shows an equivalent circuit of the crystal resonator. The crystal
resonator should have the characteristics listed in table 19.2.
Table 19.2 Crystal Resonator Parameters
Frequency (MHz) 2
Rs max ( )
Co (pF)
Use a crystal resonator with a frequency equal to the system clock frequency ( ).
Notes on Board Design: When a crystal resonator is connected, the following points should be
noted:
Other signal lines should be routed away from the oscillator circuit to prevent induction from
interfering with correct oscillation. See figure 19.4.
When the board is designed, the crystal resonator and its load capacitors should be placed as close
as possible to the XTAL and EXTAL pins.
Rev. 3.00 Mar 21, 2006 page 610 of 814
REJ09B0302-0300
L1
= C
XTAL
L2
(pF)
External Capacitance Values
500
7 pF
max
Figure 19.3 Crystal Resonator Equivalent Circuit
4
120
L
5V operation
20
10
8
80
f
25
C
L
10
70
2 f
10 to 22
C
0
20
12
60
AT-cut parallel-resonance type
16
50
3V operation
2 f
10 to 22
Rs
13
18
40
20
40
13 f
10
EXTAL
25
40
25