DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 746

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Appendix B Internal I/O Register
DASTCR—D/A Standby Control Register
DIVCR—Division Control Register
Rev. 3.00 Mar 21, 2006 page 716 of 814
REJ09B0302-0300
Bit
Initial value
Read/Write
Bit
Initial value
Read/Write
—
—
—
—
7
1
7
1
—
—
—
—
6
1
6
1
—
—
—
—
D/A standby enable
5
1
5
1
0 D/A output is disabled in software standby mode
1 D/A output is enabled in software standby mode
—
—
—
—
4
1
7
1
—
—
—
—
3
1
3
1
Divide 1 and 0
DIV1
Bit 1
0
1
H'5C
H'5D
—
—
—
—
2
1
2
1
DIV0
Bit 0
0
1
0
1
DIV1
R/W
Frequency
Division Ratio
1/1 (Initial value)
1/2
1/4
1/8
—
—
1
1
1
0
System control
System control
DASTE
DIV0
R/W
R/W
0
0
0
0