DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 587

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

The boot, user program and PROM modes are provided as modes to write and erase the flash
memory.
Notes: Only make a transition between user mode and user program mode when the CPU is not accessing
the flash memory.
1. RAM emulation possible
2. The H8/3052F is placed in PROM mode by means of a dedicated PROM writer.
3. Mode settings are shown in the following table.
FWE = 1
User mode
Mode 1
Mode 2
Mode 3
Mode 4
Mode 5
Mode 6
Mode 7
Boot mode 5
Boot mode 6
Boot mode 7
Setting prohibited
User program mode 5
User program mode 6
User program mode 7
On-board programming mode
program mode
FWE = 0
Mode
Figure 18.2 Flash Memory State Transitions
User
* 1, * 3
* 1
FWE
RES = 0
0
1
* 3
MD
0
0
0
1
1
1
1
0
0
0
1
1
1
1
RES = 0
2
Pins
MD
Reset state
0
1
1
0
0
1
1
0
1
1
0
0
1
1
1
Boot mode
* 3
MD
1
0
1
0
1
0
1
1
0
1
0
1
0
1
Rev. 3.00 Mar 21, 2006 page 557 of 814
RES = 0
0
* 2
RES = 0
PROM mode
REJ09B0302-0300
Section 18 ROM